Prevent defects from wafer scratches! High-purity PFA coating for CMP equipment.
【Scratch and Contamination Measures】Excellent non-stick properties suppress adhesion caused by slurry drying! Contributes to improved yield with high corrosion resistance and high purity coatings.
In the CMP (Chemical Mechanical Polishing) process of semiconductor manufacturing, major factors causing a decrease in wafer yield are "scratches due to the detachment of adhered slurry" and "ion contamination (metal contamination) caused by chemical corrosion." ■ Scratch Issues from Adhered Slurry When slurry that has splattered onto equipment parts dries and adheres, it can become trapped in the polishing surface and damage the delicate wafer surface. ■ Contamination from Chemical Corrosion Corrosion of the substrate by strong acids and strong alkalis can be a source of contaminating impurities that destroy circuit characteristics. ■ Preventing Slurry Adhesion and Improving Component Corrosion Resistance Our "Fluoropolymer PFA Coating" is a high-performance surface treatment solution that addresses these quality issues. With excellent "non-stick and water-repellent" properties, it prevents the adhesion of high-viscosity slurry. Even if it dries, it does not adhere and can be easily removed. Furthermore, it possesses high "chemical resistance and corrosion resistance" that is inert to chemicals, reducing the risk of metal leaching and ion contamination. The high purity and smooth coating also suppress particle generation, directly contributing to maximizing yield in the CMP process.
- Company：日建塗装工業
- Price：Other
